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背散射电子图像分析技术可用来定性和定量地研究硬化水泥浆体的微观结构,但用于背散射电子图像分析的水泥浆体需进行抛光处理,如处理不当会显著影响图像分析的准确性和精确性。介绍了水泥浆体样品抛光后的品质要求,分析了不同样品表面缺陷对图像分析结果的影响;针对水泥浆体研究了树脂镶嵌方法对镶嵌深度的影响。结果表明:提高树脂填充度是制备合格抛光样品的关键技术,树脂填充度低的抛光面一般同时存在其他缺陷,如粒子脱落、平光度低;在树脂镶嵌过程中,运用适当的操作方法可提高样品的树脂镶嵌深度。
Backscattered electron image analysis technology can be used to qualitatively and quantitatively study the microstructure of hardened cement paste. However, the cement paste used for backscatter electron image analysis needs to be polished. Improper handling can significantly affect the accuracy of image analysis and Accuracy. The quality requirements of the cement slurry samples after polishing are introduced, the influence of the surface defects of different samples on the image analysis results is analyzed, and the influence of the resin mosaic method on the mosaic depth is studied for the cement slurry. The results show that increasing the degree of resin filling is the key technology for preparing qualified polished samples. Polishing surfaces with low degree of resin filling usually have other defects at the same time, such as particle shedding and low flatness. In the process of resin inlaying, proper operation can be improved Sample resin inlay depth.