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In this article, the second generation Polyimide (Polyimide-Ⅱ, PⅠ-Ⅱ) was chosen in this research to study interfacial and heat resistant properties of T700/PⅠ-Ⅱ (carbon/PⅠ-Ⅱ) and S2/PⅠ-Ⅱ (High-strength glass fiber/PⅠ-Ⅱ) composites made by filament winding process.The shear fracture pattern of section of T700/PⅠ-Ⅱ and S2/PⅠ-Ⅱcomposites was observed by means of SEM for analyzing interfacial properties of PⅠ-Ⅱmatrix composites.