Cu Electrodeposition on a Au (111) electrode surface modified with a self-assembled monolayer (SAM) of thiols has been studied by electrochemically reductive desorption and scanning tunneling microscopy (STM) in recent years.Many authors believe that when Cu underpotential deposition (UPD) starts,the whole layer of Cu is intercalated between the SAM-Au interface because the bonding strength of Cu-S is higher than that of Au-S.In this work,we employed cyclic voltammetry to demonstrate the transference of bis-(3-sulfopropyl) disulfide (SPS) adlayer from a Au substrate to the as-deposited Cu.It was found that if SPS exists on gold electrode surface,a current peak corresponding to Cu deposition appears between -0.40 V and -0.50V versus SMSE in our system.We utilized this current peak as an indicator to identify the transference mechanism of SPS during Cu deposition.The surface morphology of the copper deposit and the surface element on the copper deposit or on the gold substrate were examined using a Field-Emission Scanning Electron Microscope (FE-SEM) and an X-ray Photoelectron Spectroscopy (XPS),respectively.We have verified that SPS is indeed transferable from the Au substrate onto the surface of the copper deposit during deposition.