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采用脉冲电沉积法制备纳米晶镍,分析了退火温度对纳米晶镍组织结构与显微硬度的影响。利用差热分析仪、扫描电镜、X射线衍射仪及显微硬度计对纳米晶镍的热稳定性、表面微观形貌、晶粒尺寸和显微应变及显微硬度进行了表征。结果表明,随着退火温度的升高,纳米晶镍的晶粒尺寸从室温时的20 nm左右逐步长大到400℃时的120 nm左右;显微应变从室温时的0.47%下降到400℃时的0.08%;显微硬度先上升,从室温时的530 HV0.01左右上升到200℃时达最大值660 HV0.01左右,此后显微硬度迅速下降,到400℃时只有330 HV0.01左右。
Nanocrystalline Ni was prepared by pulse electrodeposition method. The effect of annealing temperature on microstructure and microhardness of nanocrystalline Ni was analyzed. The thermal stability, surface micro-morphology, grain size, micro-strain and micro-hardness of nanocrystalline Ni were characterized by DTA, SEM, XRD and microhardness tester. The results show that as the annealing temperature increases, the grain size of nanocrystalline nickel gradually increases from about 20 nm at room temperature to about 120 nm at 400 ° C. The microstrain decreases from 0.47% at room temperature to 400 ° C , The microhardness first increased from about 530 HV0.01 at room temperature to about 200 HV at about 660 HV0.01, after which the microhardness rapidly decreased to only 330 HV0.01 at 400 ℃ about.