【摘 要】
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Three-dimensional Integration.Three-demensional(3D)integration is commonly defined as bonding of stacked device substrates with vertical electrical interconnects between the devicelayers.A device laye
【机 构】
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Lab.of Adhesion & Bio-Composites,Program in Environmental Materials Science,Research Institute for A
【出 处】
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2013北京国际粘接技术研讨会暨第五届亚洲粘接技术研讨会
论文部分内容阅读
Three-dimensional Integration.Three-demensional(3D)integration is commonly defined as bonding of stacked device substrates with vertical electrical interconnects between the devicelayers.A device layer may consist of one particular integrated circuitry or one set of functional devices.Besides wafer thinning andthrough-silicon via(TSV)formation,wafer bonding is the key unit process of 3Dintegration technologies.The choice of wafer bonding technologies has to be made by considering thefullprocess conditions such as temperature limitations and the sequence of the technologymodules,which may vary for different applications.
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