Study the Interfacial Bonding Strength of TiN Films Prepared by Magnetron Sputtering at Low Temperat

来源 :Fifth International Conference on Surface Engineering(第五届表面工 | 被引量 : 0次 | 上传用户:davidrandy
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  Reactive magnetron sputtering technique was used to gain titanium nitride (TiN) films on W18Cr4V high-speed steel and GCr15 bearing steel substrates at low temperature.In order to ensure substrates in a state of low temperature all the time during deposition,radio-frequency power were controlled less than 130 W,and a special-designed nickel chromium triangle nisiloy type thermocouple unit was used to measure the temperature during deposition.The technical process of TiN films are as follows:anode ion etching (-1200 V,10 min),advance deposition Ti (argon flow rate was 2.08× 10-6kg/s,VDC=180 V,Ubias=0 V,10min).deposition TiN (argon flow rate was 2.08× 10-6 kg/s,nitrogen flow rate was 4.17×10-8 kg/s,VDc=180 V,Ubias=-30 V,100~120 min).
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