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The corrosion behavior of Sn-3.0Ag-0.5Cu(SAC305)lead-free solder alloy under thin electrolyte layers containing 0.5 M NaCl has been investigated by electrochemical impedance spectroscopy(EIS),potentiodynamic polarization,electrochemical noise(EN),and surface analysis techniques as Field Emission-Scanning Electron Microscope(FE-SEM)and X-ray Diffraction(XRD)analysis.