A One Step Process for the Series Interconnection of Thin-Film PV

来源 :SNEC 第八届(2014)国际太阳能产业及光伏工程(上海)论坛 | 被引量 : 0次 | 上传用户：cxcsmile

【摘要】

：

【作者】

：

M.CROZIER A.BRUNTON G.KARTOPU S.IRVINE

【机构】

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M-Solv Ltd, Oxonian Park, UK;Heriot-Watt University, UK

【出处】

：

SNEC 第八届(2014)国际太阳能产业及光伏工程(上海)论坛

【发表日期】

：

2014年11期

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　　The series interconnection of thin-film PV can be simplified using a combination of subtractive and additive manufacturing.The current paradigm is laser patterning which interrupts the deposition of active layers; deposition of the front contact, P1 scribe,deposition of the semiconductor pn junction, P2 scribe, deposition of the back contact, P3 scribe.

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A One Step Process for the Series Interconnection of Thin-Film PV

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