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Halogen-free incombustibility has been required offlexible printed circuits(FPCs)applied for advanced digital electronic devices suchas cellphones，HDDs and LCDsbecause of tightening of environmental problems thesedays.Although epoxyadhesives have been used in producing FPCs usually，it should be a hard work toachieve halogen-free incombustibility withmaintaining the properties，such as Tg，tensile strength，elongation，peel strength，flexibility and isolation reliability. We havealready reported the effects of cycrophenoxyphosphazen(CPP) as a halogen-freeflame retardant on the properties of cured epoxy/NBR/CPP blends.It was foundthat NBR of a modifier showed some good features such as improving ductility andthen peel strength, on the other hand, NBR reduced isolation reliability in the tests ofion migration durability. Therefore, we have studied the properties of cured epoxy/phenoxy/CPP blends containing a phenoxy polymer instead of NBR and then sincewe found that those cured blends containing phenoxy as a modifier and CPP as ahalogen-free flame retardant showed high isolation reliability and high Tg withoutlosing incombustibility, we report the results.