【摘 要】
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We showed a detailed thermal simulation of a high power flip-chip packaged LED,simulation results show that the junction temperature of the LED is more sensitive to the adhesive layer material between
【机 构】
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The Fifth Research Institute of MIIT,P.R.China,Science and Technology on Reliability Physics and App
论文部分内容阅读
We showed a detailed thermal simulation of a high power flip-chip packaged LED,simulation results show that the junction temperature of the LED is more sensitive to the adhesive layer material between the Si substrate and the1000μm thick Cu heatsink,and less sensitive to the bonding ball material and the heatsink material.Otherwise,three groups of aging tests were conducted on high power flip chip LEDs,according to the linear regression analysis,the extrapolated lifetime of the high power flip chip LEDs at 25℃ is 37718hours,we also obtain an acceleration factor 70.5 of resulting in a thermal activation energy of Ea=0.35eV using Arrhenius function.
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