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5. Emergent Graphene For Interconnect Applications

Emergent Graphene For Interconnect Applications

来源 :2015台湾物理年会 | 被引量 : 0次 | 上传用户：nobodypan

【摘 要】

：

　　In this study,we propose and demonstrate electroplating of Cu on graphene seed layer.Graphene will be not only as the seed layer but also be the diffusion b

【作 者】

：

C.H.Liu C.S.Wu Y.W.Su H.Y.Lin C.D.Chen 

【机 构】

：

Departmentofphysics,NationalChang-HuaUniversityofEducation,ChangHua,TaiwanNationalNanoDeviceLaborato

【出 处】

：

2015台湾物理年会

【发表日期】

：

2015年1期

【关键词】

：

Graphene seed layer diffusion barrier copper electroplating interconnect 

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　　In this study,we propose and demonstrate electroplating of Cu on graphene seed layer.Graphene will be not only as the seed layer but also be the diffusion barrier,which combines with copper electroplating.

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