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选用Al-Cu合金进行定向凝固试验,对不同铜含量的Al-Cu合金一次枝晶微观组织形貌进行分析,并测定了一次枝晶间距。实验结果表明:在铜含量较低时,适当增加铜含量能促进枝晶生长的规整性;当含铜量为1.77%时,定向凝固组织并不明显。随着含铜量的增加,可观察到较为细小的一次枝晶组织,一次枝干呈平行生长趋势,且枝干间距较均匀,二次枝晶呈点状分布在一次枝干上。当试样铜含量从1.77%增加到3.00%时,一次枝晶间距逐步增大,但枝晶间距增加幅度较小;当铜含量较小时,试样铜含量对枝晶间距的影响不明显。
Al-Cu alloy was selected for directional solidification test. The primary dendritic microstructure of Al-Cu alloy with different copper contents was analyzed and the primary dendrite spacing was determined. The experimental results show that proper copper content can promote the regularity of dendrite growth when the content of copper is low, while the directional solidification structure is not obvious when the content of copper is 1.77%. With the increase of copper content, a relatively small primary dendritic structure can be observed. The primary branch grows in parallel and the branch spacing is more uniform. The secondary branch dendrite distributes in a dotted pattern on a branch. When the content of copper increases from 1.77% to 3.00%, the primary dendrite spacing increases gradually, but the increase of dendrite spacing is small. When the copper content is small, the influence of copper content on dendrite spacing is not obvious.