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多年来,银浆低温烧结工艺由于具有操作方便,温度较低,以及对管芯正面电极不施加任何压力,减小了管芯的损坏几率等特点,在半导体器件生产中,得到了愈来愈广泛的应用.笔者针对如何使低温银浆烧结工艺在生产上发挥更大效益,经过工艺改进和检验,提出了新的可行的工艺操作方法.为了避免烧结温度对结特性的影响,应选用尽可能低的温度,这将受到银浆需在一定温度下还原的限制.考虑到各方面的因素,我们选用了一种新的银浆配比.氧化银90克氧化铋1.6克松香7.5克松节油25毫升蓖麻油6毫升
Over the years, silver paste low temperature sintering process due to its easy operation, lower temperature, and the front of the die electrode does not exert any pressure, reducing the risk of damage to the die and other characteristics of semiconductor devices in the production has been more and more A wide range of applications.The author aimed at how to make the low temperature silver paste sintering process in the production of greater efficiency, through process improvement and testing, put forward a new feasible method of operation.In order to avoid sintering temperature on the junction characteristics, should be exhausted Possible low temperature, which will be limited by the silver paste to be reduced at a certain temperature. Considering various factors, we have chosen a new silver paste ratio. Silver oxide 90 g bismuth oxide 1.6 g rosin 7.5 g turpentine 25 ml castor oil 6 ml