皇家飞利浦电子公司(Philips Electronics)日前采用微缩超薄四方扁平无引脚(DQFN)封装,推出业界最小的BiCMOS逻辑器件。采用DQFN封装,可以提供与目前较大的BiCMOS逻辑器件同样的性能特征,而封装体积却缩小了 35%,同时成本得到降低。飞利浦采用DQFN封装的BiCMOS逻辑器件是空间 Philips Electronics has introduced the industry’s smallest BiCMOS logic device in a tiny, thin Quad Flat No Lead (DQFN) package. The DQFN package offers the same performance characteristics as current larger BiCMOS logic devices, while reducing package size by 35% while reducing costs. Philips BiCMOS logic devices in DQFN package space