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过去几年,工业部门生产的印刷电路板的不合格率为30%。由于在印刷电路组件中使用了激光焊接技术,此数字已有可观的下降。在流动焊接或一般焊接过程中,产生损失的主要原因是电路板迭层上的热冲击。而
In the past few years, the failure rate of printed circuit boards produced by the industrial sector was 30%. This figure has dropped significantly due to the use of laser welding technology in printed circuit assemblies. The main reason for the loss during flow soldering or general soldering is the thermal shock on the circuit board laminate. and