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针对光刻胶刻蚀过程模拟,提出了一种新的2-D动态元胞自动机(CA)算法。算法既有稳定性好的优点,又有运算速度快的优点。采用一些公认的光刻速率分布测试函数非常有效地模拟了光刻过程,算法在腐蚀速率变化非常大的区域也非常稳定。用该动态CA算法模拟了负化学放大胶的光刻过程,模拟结果与已有的实验结果一致。表明建立的2-D动态CA算法可以有效地用于光刻胶刻蚀过程的模拟。
A new 2-D dynamic cellular automata (CA) algorithm is proposed for the photoresist etching process simulation. The algorithm not only has the advantages of good stability, but also has the advantages of fast computing speed. The lithography process is simulated very effectively using some well-established photolithographic rate distribution test functions, which are also very stable in areas where the etch rate varies very much. The dynamic CA algorithm was used to simulate the lithography process of negative chemical amplification glue. The simulation results are consistent with the existing experimental results. It shows that the established 2-D dynamic CA algorithm can be effectively used in the simulation of photoresist etching process.