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采用压渗的方法制取了ＳｉＣ体积分数基本相同、而颗粒大小不同的ＳｉＣｐ／Ａｌ电子装封复合材料。测定热膨胀系数表明，在ＳｉＣ体积分数基本相同时，ＳｉＣ颗粒的大小对ＳｉＣ／Ａｌ复合材料的热膨胀系数影响很大。颗粒和基体界面面积的大小直接影响热应力的大小，从而影响基体的弹塑性行为。
The SiCp / Al electronic packaging composite materials with the same SiC volume fraction and different particle sizes were prepared by infiltration method. The measurement of thermal expansion coefficient shows that the size of SiC particles has a great influence on the thermal expansion coefficient of SiC / Al composites when the SiC volume fraction is basically the same. The size of the interface between particles and matrix directly affects the size of thermal stress, which affects the elastoplastic behavior of the matrix.