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混合集成电路外引线键合的方式很多。与混合集成电路的内引线键合不同,外引线键合时,键合丝的1端在管壳的引线柱上。因此,管壳外引线金属镀层的结构、镀层材料、键合丝的性能和键合工艺等因素都将影响混合电路外引线键合的质量。本文主要对Au丝球焊、Au丝点焊、SiAl丝超声焊等不同的键合工艺及其对应的金属学系统进行研究,并对其结果进行比较。采用Au丝点焊工艺键合混合电路外引线的效果最佳。
There are many ways in which the integrated IC leads are wire bonded. Different from the inner lead bonding of the hybrid integrated circuit, one end of the bonding wire is on the lead pin of the package shell when the outer lead is bonded. Therefore, the composition of the lead plating on the outer surface of the package, the properties of the plating material, the bonding wire, and the bonding process all affect the quality of the lead bonding of the hybrid circuit. In this paper, we mainly study the different bonding processes of Au wire ball welding, Au wire welding, SiAl wire ultrasonic welding and their corresponding metallographic systems, and compare the results. Using Au wire spot welding process bonding the outer lead of the hybrid circuit is the best.