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目前，国外对塑封微电路（ＰＥＭ）的可靠性研究主要集中在如下几个方面：ＰＥＭ的低温分层、失效分析、鉴定试验、长期贮存可靠性评价以及ＰＥＭ在军用电子设备中的应用等，对此进行了综述。
At present, the researches on the reliability of plastic encapsulated microcircuit (PEM) in foreign countries mainly focus on the following aspects: low temperature stratification of PEM, failure analysis, identification test, long-term storage reliability evaluation and the application of PEM in military electronic equipment, This is reviewed.