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利用传统的电阻焊技术实现了MEMS真空封装,制定了基于熔焊的工艺路线,进行了成品率实验,研究了影响真空封装器件内部真空度的各种因素,并对真空封装器件封装强度进行了检测。
The traditional vacuum resistance welding technology was used to realize the MEMS vacuum packaging, the welding process route was established, the yield test was carried out, the various factors affecting the vacuum degree of the vacuum packaging device were studied, and the packaging strength of the vacuum packaging device Detection.