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IBM公司在纽约州的East Fishkill工厂生产出了一种高速、双极逻辑芯片,这是目前计算机工业所报导的一种密度最高的芯片。该芯片象征着芯片技术的一次突破。它包含了11000多个电路,密度相当于半导体工业中其它芯片的两倍以上。该芯片采用了四层金属布线,这在半导体工业上还是第一次,而一般都只用了两层或三层布线。由于采用四层金属布线,在相同的空间范围里,电路设计者能够塞进通常的两倍以上的电路。该芯片的设计和制造都是在IBM公司的East Fishkill半导体和封装工厂的现有生产线上进行的。
IBM Corp. produced a high-speed, bipolar logic chip at its East Fishkill plant in New York State, one of the most densely-populated chips reported by the computer industry today. The chip symbolizes a breakthrough chip technology. It contains more than 11,000 circuits and is equivalent to more than twice the density of other chips in the semiconductor industry. The chip uses four layers of metal wiring, which is the semiconductor industry for the first time, but generally only two or three layers of wiring. With four layers of metal wiring, circuit designers can plug in more than twice the usual space in the same space. The chip was designed and manufactured on an existing production line at IBM’s East Fishkill Semiconductor and Packaging Factory.