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采用“铆钉法”制备了Ti-Cu扩散偶,即将预处理后的铜丝嵌入到块状钛基体中,制备包含“准相界面”的样品。观察在600～700℃真空烧结不同时间时的钛铜界面的扩散情况,研究了烧结温度和保温时间对扩散层厚度的影响。结果表明,扩散层的厚度随烧结温度的提高和保温时间的延长而增厚。
The Ti-Cu diffusion couple was prepared using the “rivet method”, in which the pretreated copper wire was embedded in a bulk titanium matrix to prepare a sample containing a “quasi-phase interface”. The diffusion of titanium-copper interface at 600-700 ℃ for different time was observed. The effects of sintering temperature and holding time on the thickness of diffusion layer were investigated. The results show that the thickness of diffusion layer increases with the increase of sintering temperature and holding time.