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一般认为,采用Cu-P基钎料钎焊铜/304不锈钢时,易在钎料与不锈钢之间的界面上生成脆性化合物层,使得接头强度极低。为了解决该问题,尝试在Cu-P-Ni钎料中添加Sn元素,并研究Sn对钎料熔化温度、铺展性、接头剪切强度及焊缝组织的影响。结果表明,Sn元素的加入,可以降低其熔化温度,改善其铺展性能,并可将接头的剪切强度提高到120MPa以上。该钎料成本低,熔化温度低,钎焊强度高,适用于铜/304不锈钢钎焊。
Generally believed that the use of Cu-P-based brazing brazing copper / 304 stainless steel, easy solder and stainless steel in the interface between the formation of brittle compound layer, making the joint strength is extremely low. In order to solve this problem, we tried to add Sn element to Cu-P-Ni solder and studied the influence of Sn on the melting temperature, spreadability, shear strength of joint and weld microstructure. The results show that the addition of Sn can reduce the melting temperature and improve the spreading performance, and increase the shear strength of the joint to over 120 MPa. The solder has low cost, low melting temperature and high brazing strength, and is suitable for brazing copper / 304 stainless steel.