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基于Shockley 方程提出用双电流法测量半导体器件的结温,并与传统的线性近似法进行对比,消除了由于不同器件热电性能的差异引入的误差,提高了结温测量精度
Based on the Shockley equation, the junction temperature of the semiconductor device is measured by the double current method. Compared with the traditional linear approximation method, the error caused by the difference of the thermoelectric performance of different devices is eliminated and the junction temperature measurement accuracy is improved