意法半导体(STMicroelectronics,简称ST)宣布其NFC非接触式通信技术集成到联发科技的移动平台内,为手机开发企业研发能够支持高集成度NFC移动服务的下一代智能手机提供一个完整的解决方案。意法半导体的NFC芯片组和联发科技的移动支付平台的合作整合,旨在帮助移动OEM厂商克服重大技术挑战(例如,天线设计和集成、天线微型化、物料清单优化),同时确保手机与零售商店、交通枢纽等地点的移动 STMicroelectronics (ST) announced that its NFC contactless communications technology is integrated into MediaTek’s mobile platform to provide a complete solution for handset development companies developing the next generation of smartphones capable of supporting highly integrated NFC mobile services . STMicroelectronics’ NFC chipset and MediaTek’s mobile payment platform are designed to help mobile OEMs overcome significant technology challenges such as antenna design and integration, antenna miniaturization, and bill of materials optimization, while ensuring that mobile phones and retail Shops, transport hubs and other locations of the move