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现今全球在10Gb/s速度以上的高端多层PCB设计案例,由于涉及许多高速电路分析理论及仿真技术经验,因而大都还是由欧美大厂主导设计。多数亚洲公司尚未有完整实力能与欧美竞争对手在此利基型市场上相抗衡。
Nowadays, the high-end multi-layer PCB design cases at speeds above 10Gb / s worldwide are mostly designed by leading European and American manufacturers because they involve many high-speed circuit analysis theories and simulation technology experiences. Most Asian companies do not yet have the full strength to rival Europe and the United States in this niche market to compete.