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电镀型磁盘的基板是由铝合金及非电解镍镀膜等不同材料构成的,所以具有因研磨和施镀等加工处理而产生的复杂残余应力。本文中,用理论式表示了由各层残余应力所引起的盘的变形量,并与在铝合金上形成的非电解镍镀层的两层典型盘的加工实验进行了对比,证明所推导的理论式是正确的。其结果,镀应力取决于镀液的pH 值,而研磨盘面所产生的残余应力取决于磨粒直径。镀面加工变质层的深度和铝合金相比较是极小的。而且对直径360毫米的镀型磁盘基板的加工变形进行了模拟,表明了由上下面的镀层及加工变质层深度的不均衡引起的变形量,在不平衡率为50%时达到140—200微米。
Plating type disk substrate is made of different materials such as aluminum alloy and non-electrolytic nickel coating, so with complex processing of grinding and plating and other complex residual stress. In this paper, the deformation of the disk caused by the residual stress of each layer is expressed theoretically, and compared with the processing experiment of two typical disks of electroless nickel plating formed on the aluminum alloy, which proves that the theory The formula is correct. As a result, the plating stress depends on the pH of the bath and the residual stress generated by grinding the disk depends on the particle diameter. The depth of the surface modification layer is extremely small compared to the aluminum alloy. Moreover, the processing deformation of a plated disk substrate with a diameter of 360 mm was simulated, which shows that the deformation caused by the imbalance of the depths of the upper and lower plating layers and the processed deterioration layer reaches 140-200 μm when the unbalance rate is 50% .