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最近老的金属平版刻蚀工艺有了改进,以适于制造计算机的微晶片及根据新的要求制造很小的化学传感器。这项技术是新的,异于常规的微晶片制造方法。它是将集成电路刻在硅基片上,在金属膜上形成,绝缘及半导体部分。根据不同的图样用“抗蚀剂”屏蔽,“抗蚀剂”通常是用有机聚合物,底膜对辐射是敏感的。经过辐射后,某些晶格得到屏蔽及某些受到辐射的轰击。再以不同的溶剂将辐照及不辐照部溶蚀。这就象常规的冲洗照片的显像一样。然后正反图形加以修整。再将溶剂去掉。很小的晶片上亦能刻蚀所需要的图样。制造2μm的薄片已有完整的装置可以用于生产。有可
Recent advances in lithographic lithography of the metal have been refined to make microcomputers available for computer manufacture and to make very small chemical sensors based on new requirements. This technology is new and different from the conventional method of making microchip. It is the IC engraved on the silicon substrate, formed in the metal film, insulation and semiconductor parts. Depending on the pattern being “masked” with “resist”, “resist” is usually made of organic polymer and the underlying film is radiation sensitive. After radiation, certain lattices are shielded and some are attacked by radiation. Then a different solvent will be irradiated and non-irradiated Department of corrosion. This is the same as the conventional development of photographic images. Then positive and negative graphics to be trimmed. Remove the solvent. A very small wafer can also etch the desired pattern. There are complete devices available for the production of sheets of 2 μm. There can be