论文部分内容阅读
在HCO_3~-和Cl~-浓度不同的溶液中,用循环极化的电化学测试方法和SEM,对Cu的循环极化行为和点蚀表面形貌进行了研究.结果表明,该体系中Cu的腐蚀行为可概括为活性溶解型腐蚀、钝化型腐蚀、活性溶解型点蚀和钝化膜破裂型点蚀等4种类型;在HCO_3~-或Cl~-单独存在环境中,Cu表面不发生点蚀,只有Cl~-和HCO_3~-共同存在且起协同作用时,Cu表面才发生点蚀;活性溶解型点蚀区域中,点蚀敏感性随Cl~-浓度的升高而增大,而随HCO_3~-浓度的升高先增大后减小;钝化膜破裂型点蚀区域中,点蚀敏感性随Cl~-浓度的升高和HCO_3~-浓度的降低而增大.
The cyclic polarization behavior and pitting surface morphology of Cu were investigated by cyclic polarization electrochemical test and SEM in different concentrations of HCO 3 ~ - and Cl ~ -. The results show that Cu The corrosion behavior can be summarized as active dissolution type, passivation type, active dissolution type and passive film type. In the presence of HCO 3 ~ - or Cl ~ - alone, the Cu surface is not Pitting occurs only in the presence of Cl ~ - and HCO_3 ~ -, and pitting occurs only on the Cu surface. In the active dissolution pitting area, the pitting corrosion sensitivity increases with increasing Cl ~ - concentration , And the HCO 3 ~ (-) concentration firstly increased and then decreased with the increase of HCO 3 ~ - concentration. The pitting corrosion sensitivity increased with the increase of Cl ~ - concentration and the decrease of HCO 3 - concentration in the cracked pitting area.