论文部分内容阅读
为了将Al-Ti多层膜更好地应用于反应微焊接技术,本文采用磁控溅射方法制备了五种不同调制周期和总厚的Al-Ti反应多层膜,分别使用电子探针显微分析仪、扫描电子显微镜、X射线衍射仪和同步热分析仪等对样品的结构和热性能进行研究。结果表明:纳米级多层膜的反应性明显高于微米级膜层。调制周期对纳米多层膜的反应性影响显著,随着周期减小,多层膜的起始反应温度降低、反应温度区间缩小、反应放热量增加,更易完成自蔓延反应。多层膜的调制周期超过600 nm时反应较弱,低于300 nm时反应较强,要实现低温反应微焊接,Al-Ti多层膜的调制周期应控制在100 nm左右。
In order to apply the Al-Ti multi-layer film to the micro-welding technology better, five kinds of Al-Ti multi-layer films with different modulation periods and thicknesses were prepared by magnetron sputtering method. Micro-analyzer, scanning electron microscopy, X-ray diffraction and synchronous thermal analysis of the sample structure and thermal properties were studied. The results show that the reactivity of nanoscale multilayers is obviously higher than that of micrometer-scale ones. The modulation cycle has a significant effect on the reactivity of the nano-multilayer. With the decrease of the cycle, the initial reaction temperature of the multilayer decreases, the reaction temperature decreases, and the exothermic heat increases. It is easier to complete the self-propagating reaction. When the modulation period of the multi-layer film exceeds 600 nm, the reaction is weak, and the reaction is strong when the modulation period is less than 300 nm. The modulation period of the Al-Ti multilayer film should be controlled at about 100 nm in order to achieve micro-soldering at low temperature.