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引言最近,载带自动焊接(TAB)工艺的进展,使得混合集成电路的组装自动化有了可能。由于混合集成电路的产量一般说来都比较低,至少与单片电路相比是低的,这样,在自动化方面就会碰到一些基本的问题。因为 TAB 组装设备的成本高、各种不同尺寸芯片的品种多,所以必须进行一定程度的标准化,以使 TAB 工艺经济上行之有效,它在成本方面的最大的潜在优点是芯片在组装前可以进行预测,这一点是 TAB 工艺设备昂贵所抵销不了的。
INTRODUCTION Recently, advances in tape automated bonding (TAB) processes have made it possible to automate the assembly of hybrid integrated circuits. Since hybrid ICs are typically produced at low yields, at least as low as monolithic circuits, there are some basic problems with automation. Because of the high cost of TAB assembly equipment and the large variety of chips of various sizes, some degree of standardization is necessary to make the TAB process economically viable and its greatest potential benefit in terms of cost is that the chip can be pre-assembled It is predicted that this can not be offset by the expensive TAB process equipment.