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采用阳极层流型离子源结合非平衡磁控溅射技术制备了含氢掺钨类金刚石(W-DLC)薄膜,利用TEM、SEM、XRD、Raman光谱仪和摩擦磨损试验机等方法分析了薄膜的结构、形貌以及在高温下的摩擦学性能,探讨了W-DLC薄膜在高温下摩擦磨损行为作用机理.结果表明:W-DLC薄膜中钨原子以WC1-x纳米晶团簇的形式随机分布于碳基质中,增强了薄膜的韧性.W-DLC薄膜在25~200℃范围内的摩擦系数可稳定在0.1以下,在300℃时的摩擦系数则高达0.5,当试验温度进一步升高到400℃时,薄膜的摩擦系数反而降低至0.3左右,当试验温度升高到500℃时,W-DLC薄膜中的W被氧化生成WO_3和摩擦诱导生成的石墨共同作用,使得薄膜的摩擦系数降到0.15左右,说明W-DLC薄膜在高温下仍然具有优异的减摩特性.然而,W-DLC薄膜的磨损率在25~500℃范围内表现出随着温度的升高而不断增大的趋势.
The hydrogen-doped tungsten-doped diamond (W-DLC) thin films were fabricated by anodic layer current source combined with unbalanced magnetron sputtering. The films were characterized by TEM, SEM, XRD, Raman spectroscopy and tribometer. Structure and morphology as well as the tribological properties at high temperature were investigated.The mechanism of friction and wear behavior of W-DLC films at high temperature was discussed.The results show that tungsten atoms in W-DLC films are randomly distributed in the form of WC1-x nanoclusters In the carbon matrix, the toughness of the film is enhanced. The friction coefficient of W-DLC film in the range of 25 ~ 200 ℃ can be stabilized at 0.1 and the friction coefficient at 300 ℃ is as high as 0.5. When the test temperature is further increased to 400 ℃, the friction coefficient of the film decreased to about 0.3. When the test temperature was increased to 500 ℃, W in the W-DLC film was oxidized to form WO_3 and co-induced by friction-induced graphite, so that the friction coefficient of the film decreased to 0.15, indicating that the W-DLC film still has excellent anti-friction properties at high temperature.However, the wear rate of W-DLC film shows a tendency of increasing with the increase of temperature in the range of 25 ~ 500 ℃.