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为了分析集束型半导体装备的性能,研究了系统批加工过程的随机回报网模型,模型不仅可以描述装备的批加工过程和机械手的操作序列,还可以用来分析装备的性能。该模型适用于装备的并行晶圆流和串行晶圆流、串-并混合型模式。在模型中,用变迁的实施速率表示装备加工操作的频率。在模型中还引入了变迁的实施函数来控制不同状态下机械手动作,以避免死锁发生。最后应用该模型,以晶圆流模式(2,1,1)为例,分析了系统配置参数对系统吞吐量的影响。
In order to analyze the performance of cluster semiconductor equipment, the random report net model of batch processing is studied. The model can not only describe the batch processing of equipment and the operation sequence of manipulator, but also can analyze the performance of equipment. The model is suitable for equiped parallel wafer flow and serial wafer flow, serial-mixed mode. In the model, the rate at which the equipment is machined is represented by the rate of change in implementation. In the model also introduced the implementation of changes in the function to control the manipulator in different states to avoid deadlock. Finally, the model is applied to analyze the influence of the system configuration parameters on the system throughput by taking the wafer flow mode (2, 1, 1) as an example.