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本文简要介绍半绝缘多晶硅薄膜技术在半导体领域中应用的二个方面：钝化膜和硅－半绝缘多晶硅异质结．着重阐述了半绝缘多晶硅的钝化机理，以及它在半导体器件中应用的工艺过程．采用半绝缘多晶硅钝化膜，可以制成无沟道截止环的ＣＭＯＳ电路，以获得高集成度、高汤阈值电压和高可靠性的ＭＯＳ器件；可以使双极型ｎｐｎ和ｐｎｐ晶体管的可靠性提高，而且具有更高的击穿电压。
This article briefly describes the two aspects of semi-insulating polysilicon thin film technology used in the semiconductor field: passivation film and silicon - semi-insulating polysilicon heterojunction. Emphatically expounds the passivation mechanism of semi-insulating polysilicon, as well as its application in semiconductor devices process. The use of semi-insulating polysilicon passivation film, can be made without the channel of the ring CMOS circuit to obtain high integration, the threshold voltage and high reliability of the MOS device; can make bipolar npn and pnp transistor reliability , But also has a higher breakdown voltage.