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通过选择基体预热温度、激光功率、扫描速度、光斑直径为影响因素,用正交试验方法在40Cr基体上进行熔覆Cr18Ni8Mo2Si研究;通过测试残余应力、显微硬度和观察金相组织等研究熔覆基体温度对熔覆层质量的影响,经研究随着预热温度的上升,残余应力减小,最小的残余应力参数组合为预热温度400℃、激光功率1 200 W、扫描速度4 mm·s-1、光斑直径3 mm;随着预热温度的提高,从显微组织看,组织缺陷减少,结合效果变好;熔覆层显微硬度也随着预热温度的提高而明显增大.
By selecting the substrate preheating temperature, laser power, scanning speed and spot diameter as the influencing factors, the Cr18Ni8Mo2Si was studied by orthogonal test on the 40Cr substrate. The residual stress, microhardness and microstructure With the increase of the preheating temperature, the residual stress decreases. The minimum residual stress parameters are preheat temperature 400 ℃, laser power 1200 W, scanning speed 4 mm · s-1 and spot diameter of 3 mm. With the increase of preheating temperature, the defects of the microstructure were reduced and the bonding effect was improved. The microhardness of cladding layer also increased obviously with the increase of preheating temperature .