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采用两种铜基钎料HL841(CuZnMnSnNiCo合金)和HL105(CuZnMn合金)对YG8硬质合金和低碳钢进行真空钎焊,并对比研究了焊缝的微观组织、元素扩散情况及接头抗拉强度。研究表明:两种钎料与硬质合金结合处形成互溶区,HL105形成的互溶区宽度大概为1μm,而HL841形成的互溶区宽度约为3μm;HL841钎料中的Co、Ni等元素有利于形成Fe-Co-Ni单相固溶体,同时钎焊过程中钎料中的Co还能缓解硬质合金中粘结相Co的扩散流失。这些原因使得采用HL841焊接的试样的接头力学性能优于HL105。
YG8 cemented carbide and mild steel were vacuum brazed with two Cu-based brazing filler metals HL841 (CuZnMnSnNiCo alloy) and HL105 (CuZnMn alloy), and the microstructure, elemental diffusion and joint tensile strength . The results show that the two solders and the cemented carbide form a mutual solubility zone, the width of the mutual solubility zone formed by HL105 is about 1μm, and the width of the mutual solubility zone formed by HL841 is about 3μm. Elements such as Co and Ni in HL841 solder are favorable The formation of Fe-Co-Ni single phase solid solution, while the brazing brazing process of Co can ease the cemented carbide binder phase diffusion loss. These reasons make the mechanical properties of joints using HL841 welding better than HL105.