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研究了倒金字塔填充型锥尖及正向刻蚀硅尖的制备工艺,采用了两种封装结构测试了场发射硅尖阵列的发射特性,并分析比较了这两种结构的特点及用于制备高频微波器件的可能性。
The pyramid tip filled pyramid and forward etching silicon tip preparation process, the use of two packages tested the emission characteristics of field emission silicon tip array, and analysis of the characteristics of these two structures and for the preparation of High-frequency microwave device possibilities.