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低热导率材料广泛应用于航空发动机涡轮叶片等许多尖端领域,可缓冲外界热量进入体合金,从而提高基底材料的寿命或提高本地材料的耐高温性能。众所周知,空气的热导率低,在材料中加入空气可有效提高热量缓冲作用。文中,我们采用ICP技术对硅片进行深沟刻蚀,用3D显微镜、SEM观察样品表面形貌、用导热系数测试仪(护热平板法)测试样品的热导率,通过在深沟中填充不同含量的空气,研究薄膜中空气含量与热导率的关系。同时,用烧结法制得多孔结构的泡沫铜和泡沫镍,研究了孔隙率和热导率的关系,进一步用计算机仿真方法分析比较了不同孔隙率材料的热导率。研究表明:空气的填充确实可降低材料的热导率,对降低材料的热导率具有一定的意义。
Low thermal conductivity materials are widely used in many cutting-edge areas such as aero-engine turbine blades to buffer external heat from entering the bulk alloy, thereby increasing the life of the substrate material or increasing the high-temperature performance of the local material. It is well-known that the thermal conductivity of air is low. Adding air to the material can effectively enhance the heat buffering effect. In this paper, we use the ICP technology for deep groove etching of silicon wafers. The surface morphology of the samples is observed with a 3D microscope and a SEM. The thermal conductivity of the samples is tested with a thermal conductivity tester (hot plate method) Different air content, the relationship between the air content in the film and the thermal conductivity. At the same time, porous copper foam and nickel foam were prepared by sintering method. The relationship between porosity and thermal conductivity was studied. The thermal conductivity of materials with different porosity was further analyzed by computer simulation. The results show that the filling of air can indeed reduce the thermal conductivity of the material, which has some significance for reducing the thermal conductivity of the material.