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为了提高某产品用电子设备的可靠性,近年来对电子设备进行了大量的模拟试验。通过试验取得了许多宝贵的资料,同时也对振动中失效的部分元器件和结构件进行了分析,对其失效模拟和机理有了一定的了解;同时也发现了振动控制技术上存在的一些问题。本文将做一些粗浅的分析。过去我们曾对部分产品上电子设备振动试验中出现的失效模式进行了统计,主要有六种失效模式,其中元器件断脚失效占29％,元器件短路失效占31％,结构件振断振裂占7％,紧固件松动占10％,可调元件参数变化占9％。下边将主要的失效模式及失效机理和应当采取的措施分别介绍如下。
In recent years, a large number of simulation tests have been conducted on electronic equipment in order to improve the reliability of a product’s electronic equipment. Through the experiment, a lot of valuable data have been obtained. At the same time, some components and structures that have failed in vibration have been analyzed, and their failure simulation and mechanism have been understood. At the same time, some problems in the vibration control technology have also been found . This article will do some superficial analysis. In the past, we have conducted statistics on the failure modes of some products on the vibration test of electronic equipment. There are mainly six failure modes, of which 29% are broken legs, 31% are short-circuit failures, Crack accounted for 7%, fasteners loose accounted for 10%, adjustable component parameters change accounted for 9%. Below will be the main failure mode and failure mechanism and the measures should be taken as follows.