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A constant deflection device designed for use within a transmission electron microscopy (TEM) was used to investigate the change in dislocation configuration ahead of a crack tip during stress corrosion cracking (SCO of type 310 austenitic stainless steel in a boiling MgCI2 solution, and the initiation process of stress corrosion microcrack. Results showed that corrosion process during SCC enhanced dislocation emission, multiplication and motion. Microcracks of SCC were initiated when the corrosion-enhanced dislocation emission and motion reached critical state.A passive film formed during corrosion of austenitic stainless steel in the boiling MgCI2 solution generated a tensile stress. During SCC, the additive tensile stress generated at the metal/passive film interface helps enhance dislocation emission and motion.
A constant deflection device designed for use within a transmission electron microscopy (TEM) was used to investigate the change in dislocation configuration ahead of a crack tip during stress corrosion cracking (SCO of type 310 austenitic stainless steel in a boiling MgCI2 solution, and the initiation process of stress corrosion microcrack. Results showed that during SCC enhanced dislocation emission, multiplication and motion. Microcracks of SCC were initiated when the corrosion-enhanced dislocation emission and motion reached critical state. A passive film formed during corrosion of austenitic stainless steel in the boiling MgCl 2 solution generated a tensile stress. During SCC, the additive tensile stress generated at the metal / passive film interface helps enhance dislocation emission and motion.