论文部分内容阅读
采用化学镀工艺,在Q235基材上制备出2~4μm的Cu-Mn合金化学镀层.在650℃~870℃温度范围内对化学镀层进行了真空扩散焊接试验.利用金相和扫描电镜对接头进行了微观组织和能谱分析,并用拉伸试验评价了接头的连接强度.研究结果表明,在相同工艺参数条件下,镀有Cu-Mn化学镀层的试件其剪切强度比无镀层试件提高1倍以上;高温扩散焊接时接头的连接强度提高,但基体组织比低温扩散焊接时显著粗化.图3,表2,参7.
The electroless plating process was used to prepare 2 ~ 4μm Cu-Mn alloy electroless plating on Q235 substrate.The vacuum diffusion welding experiment of electroless plating was carried out in the temperature range of 650 ℃ ~ 870 ℃ .According to metallographic and SEM The microstructure and energy spectrum analysis were carried out, and the connection strength of the joint was evaluated by tensile test.The results show that under the same process parameters, the shear strength of Cu-Mn electroless plated coating is higher than that of uncoated test piece Increase by more than 1 time; the connection strength of the joint increased at high temperature diffusion welding, but the matrix microstructure was significantly roughed than the low temperature diffusion welding.