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本文介绍了某型机载吊舱底板作为电子设备发热元件散热器冷却效果的分析研究。采用CFD仿真软件对吊舱散热底板中的流场进行了分析,得出不同工况下散热器流道内的风速;采用ICEPAK软件对散热模型进行了仿真计算,对散热方案的可行性进行了详细的分析;并最终通过试验验证。
This paper introduces the analysis of the cooling effect of a type of airborne pod floor as a heat sink for electronic device heating element. The CFD simulation software was used to analyze the flow field in the pod cooling floor, and the wind speed in the radiator flow path under different conditions was obtained. The ICEPAK software was used to simulate the cooling model and the feasibility of the cooling scheme was detailed Analysis; and finally passed the test.