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介绍了一种新颖的基于电子附着(Electron Attachment,EA)原理的氢气活化技术,可以实现在大气压力和正常焊接温度下的无助焊剂焊接。该技术有望被应用于电子封装行业的诸多领域。
A novel hydrogen activation technique based on the principle of Electron Attachment (EA) is introduced to achieve fluxless soldering at atmospheric pressure and normal soldering temperature. The technology is expected to be used in many areas of the electronics packaging industry.