论文部分内容阅读
设计并合成了一种环氧树脂潜伏性固化剂二苯基双胍。采用FTIR和1HNMR表征了固化剂的化学结构,并通过DSC分析得到环氧树脂与固化剂的最佳质量配比为5∶1,固化活性实验及凝胶实验分析得到最佳固化温度为130℃,储存期为室温下30 d,拉伸实验分析了固化物的抗拉强度可达38.07 MPa,采用TG测试得到固化物的热分解温度超过270℃。结果表明,与双氰胺环氧树脂固化体系相比,该固化剂和环氧树脂有更好的相容性,潜伏性良好,其固化温度降低30℃以上,固化物有更优异的力学性能和良好的热稳定性。
An epoxy latent curing agent diphenylbiguanide was designed and synthesized. The chemical structure of the curing agent was characterized by FTIR and 1HNMR. The best mass ratio of the epoxy resin to the curing agent was 5:1 by DSC. The best curing temperature was 130 ℃ by the curing activity test and gel analysis. , The storage period is 30 d at room temperature, tensile test analysis of the cured material up to 38.07 MPa tensile strength, the TG test results obtained thermal decomposition temperature of over 270 ℃. The results show that compared with the dicyandiamide epoxy curing system, the curing agent and the epoxy resin have better compatibility and good latent property, the curing temperature is lower than 30 ℃, and the cured product has more excellent mechanical properties And good thermal stability.