随着电子设备的日益复杂,对电子元件的可靠性要求也愈来愈高。特别是那些用于恶劣环境的空间电子设备,可靠性更是不可忽视的问题。 FC-54是一种低功耗高增益双极型运算放大器,用途广泛。但由于一些工艺问题,如单电极钨丝蒸铝工艺,硅片在镀膜室中又不旋转,造成了铝膜在跨越各种台阶时的“阴影”。这部分铝膜很薄而脆弱,在进行铝线反刻时,很容易受到腐蚀剂的侵蚀,造成开路。即使没有完全断开的铝膜,在经过高温功率老化和较长时间的工作,也将造成开路,使器件的可靠性大大降低。为了早期判断和分析器件的失效原因。我们采用了扫描电镜电压衬度法作为分析手段,特别是对铝膜的失效分析,显示了良好的优越性。因为,运用机械探针对芯片进行电参数的测试,不可避免地会给芯片带 With the increasingly complex electronic devices, the reliability requirements of electronic components are also getting higher and higher. Especially for those space electronics used in harsh environments, the reliability is more than negligible. The FC-54 is a low power, high gain, bipolar op amp for a wide range of uses. However, due to some process problems, such as the single-electrode tungsten wire steamed aluminum process, the silicon wafer does not rotate in the coating room, resulting in the “shadow” of the aluminum film as it crosses various steps. This part of the aluminum film is very thin and fragile. When the aluminum wire is reverse-etched, it is easily eroded by the etchant, resulting in an open circuit. Even if there is no completely broken aluminum film, after high-temperature power aging and a long time of work, will result in open circuit, the reliability of the device greatly reduced. In order to early determine and analyze the failure of the device. We adopted the scanning electron microscope voltage contrast method as the analysis method, especially the failure analysis of the aluminum film, which shows good superiority. Because, the use of mechanical probe chip electrical parameters of the test, will inevitably give the chip with