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印刷电路板换热器是超高温气冷堆等高温能量利用与回收领域中极具潜力的备选强化传热技术之一,本文通过数值模拟方法对典型Z字形印刷电路板(PCHE)传热通道的传热和阻力特性开展了相关研究。计算结果表明:层流模型可以较好地获得Z字形PCHE通道的阻力和传热性能,Z字形PCHE通道的阻力系数大于半圆管直通道的阻力系数;当热侧和冷侧通道流体入口温度均不发生改变时,增加两侧流体的质量流量,通道内的阻力系数随之减小,传热效率也稍微减小;当两侧流量及冷侧入口温度均不发生改变时,提高热侧通道入口温度,通道内阻力系数成线性增大,传热效率也随之提高。
Printed circuit board heat exchanger is one of the most promising alternative heat transfer technologies in the field of high temperature gas-cooled reactor such as high-temperature gas-cooled reactor. In this paper, a numerical simulation method is applied to the heat transfer of typical Z-shaped printed circuit board (PCHE) Channel heat transfer and resistance characteristics of the relevant research. The calculation results show that the laminar flow model can obtain the resistance and heat transfer performance of the zig-zag PCHE well, and the resistance coefficient of the zigzag PCHE channel is larger than the drag coefficient of the semicircular pipe. When both the inlet temperature of the fluid on the hot side and the cold side When there is no change, the mass flow of the fluid on both sides increases, the drag coefficient in the channel decreases and the heat transfer efficiency also decreases slightly. When the flow rate on either side and the inlet temperature on the cold side do not change, the hot side channel The inlet temperature, channel resistance coefficient increases linearly, heat transfer efficiency also increases.