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对TiC金属陶瓷和304不锈钢进行真空扩散连接实验,并采用Ti/Nb/Cu中间层以实现活性连接并缓解接头残余应力的目的。对焊后接头进行详细的组织分析和力学性能测试来评估焊接工艺。分析发现在TiC金属陶瓷和304不锈钢之间形成明显的转变过渡区,界面反应产物为(Ti,Nb)、剩余Nb、剩余Cu以及Cu(s.s)。连接温度925℃,保温时间20 min,压力8 MPa下得到的接头剪切强度达84.6 MPa,此时脆性断裂发生在靠近界面处的陶瓷内部。结果表明,中间层Ti/Nb/Cu的合理选择能很好的降低金属间化合物对接头性能的有害作用,而且Nb对接头残余应力的改善起到关键作用,有效的提高了接头强度。
The vacuum diffusion bonding experiments of TiC cermets and 304 stainless steel were carried out, and the Ti / Nb / Cu interlayer was used to realize the active connection and relieve the residual stress of joints. After welding the joints for detailed organizational analysis and mechanical properties testing to evaluate the welding process. The results show that the transitional zone between TiC and 304 stainless steel is formed. The interfacial reaction products are (Ti, Nb), residual Nb, residual Cu and Cu (s.s). The joint shear strength reached 84.6 MPa with the connection temperature of 925 ℃, holding time of 20 min and pressure of 8 MPa. At this time, the brittle fracture occurred in the ceramic near the interface. The results show that the reasonable choice of Ti / Nb / Cu interlayer can reduce the detrimental effect of intermetallic compounds on the joint performance, and Nb plays a key role in improving the residual stress of the joint, which effectively improves the joint strength.