Microstructures and properties of low-melting-point Al-Cu-Si filler metals prepared by different tec

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The Al25Cu6. 5Si0. 09RE (RE = La and Ce) and Al25Cu10.5Si2Ni filler metals were prepared by common metal mold casting, copper plate chilling and rapid solidification, respectively. The microstructures and properties of these filler metals were studied. The results show that the as-casting and the corresponding rapid solidification filler metals have the same phases but their microstructures are different. The microstructure of rapid solidification filler metals consults of an a-Al solid solution, the 6 (Al2Cu) intermetallic compound and an Al-Cu-Si eutectk phase. Compared with the as-casting filler metal, the melting temperature ranges (△T) of the corresponding copper plate chilling and rapid solidification filler metals decrease and their wettabilities are improved because of the grain refinement and the improvement of composition uniformity. The wetting area of Al25Cu6.5Si0.09RE rapid solidification filler metal doubles that of the corresponding as-casting filler metal. It is hopeful that the properties of Al-Cu-Si filler metals will be improved by changing preparation technology.
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