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针对板级焊点在振动载荷下的失效问题,搭建了具有焊点电信号监测功能的振动加速失效实验平台,在定频定幅简谐振动实验的基础上,对表征信号进行分析,通过电阻信号峰值标定焊点的失效程度。实验结果表明,焊点失效初期呈现为3个阶段,每个阶段包含电阻变化的平缓区间和陡变区间。随着3个阶段的改变,焊点低阻值区间振动循环数递减,焊点高阻值区间振动循环数递增。在此基础上,以电阻均值表征焊点平均失效程度,建立了表征焊点振动疲劳寿命的多项式模型,可以描述不同阶段焊点阻值和振动循环数的关系。
Aiming at the failure problem of plate-level solder joint under the vibration load, a vibration accelerated failure experimental platform with solder joint electrical signal monitoring function is set up. Based on the fixed frequency vibration test, the characterization signal is analyzed, Signal peak calibration solder joint failure level. The experimental results show that the initial stage of solder joint failure appears as three stages, each stage contains the resistance interval and the transitional interval. With the changes of the three stages, the number of vibration cycles in the low resistance region of the solder joint decreases and the number of vibration cycles in the high resistance region of the solder joint increases. On the basis of this, the average failure rate of solder joint is characterized by means of resistance average. A polynomial model is established to characterize the fatigue life of solder joint. The relationship between the resistance of solder joint and the number of vibration cycles can be described.