一、三维集成电路随着大规模集成电路集成度的提高,通常的二维集成电路逐渐受到微细加工精度的限制,研制新型的真正立体结构的三维集成电路,近几年来引起了国际上许多国家的注意.美国斯坦福大学、贝尔实验室、麻省理工学院、德克萨斯仪器公司等先后开展了三维集成电路的探索研究.日本制定的九十年代产业基础技术研究开发规划中,把三维集成电路的研 First, the three-dimensional integrated circuits With the improvement of the integration of large-scale integrated circuits, the usual two-dimensional integrated circuits are gradually subject to the precision of the micro-processing, the development of a new type of three-dimensional integrated circuits of the real three-dimensional structure in recent years has caused many countries The United States Stanford University, Bell Laboratories, Massachusetts Institute of Technology, Texas Instruments, etc. have conducted research and exploration of three-dimensional integrated circuits.Japanese-made industrial base technology research and development program in the nineties, the three-dimensional integration Circuit research